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Cracks:
Cracks occur when poor part design or inferior plastic material properties cause high internal stress, uneven cooling, poor demolding, or other defects. These stresses lead to cracks forming at stress concentration points or near the gate. Under overload or the influence of solvents, these cracks may propagate, resulting in part failure.
No. | Causes | Solutions |
---|---|---|
15.1.1 | Low material temperature, poor demolding | Increase material temperature, repair mold |
15.1.2 | High holding pressure, long holding time | Reduce holding pressure and holding time |
15.1.3 | Screw rotation speed too high | Reduce screw speed |
15.1.4 | Low back pressure | Increase back pressure |
15.1.5 | Poor ejection or ejection speed too fast | Balance ejection, adjust speed appropriately |
15.1.6 | Mold temperature too low or uneven | Adjust mold temperature, ensure uniform cooling based on part structure |
15.1.7 | Cooling time too long or too short | Adjust cooling time according to wall thickness |
15.1.8 | Insert not preheated or insufficiently preheated | Preheat inserts to match thermal expansion before molding |
15.1.9 | Insert not cleaned properly | Clean inserts thoroughly |
15.1.10 | Thin walls, small draft angles, sharp corners or notches, high internal stress | Increase draft angles, add OR at sharp corners where possible, reduce stress concentration |
15.1.11 | High injection pressure, excessive stress (see warpage) | Reduce injection pressure, post-process to relieve internal stress if needed |
15.1.12 | Large or improperly designed gate, high internal stress at gate | Adjust gate size and design to reduce stress |
15.1.13 | Uneven cooling after demolding or post-processing | Ensure uniform cooling after demolding or post-processing |
15.1.14 | Brittle plastic or contaminated with foreign materials | Do not use materials mixed with impurities |
15.1.15 | Improper mold release agent, poor demolding | Choose appropriate release agent or repair mold for easier demolding |
15.1.16 | Material not dried properly | Dry materials thoroughly |
15.1.17 | ABS or HIPS may show fine white lines at ejector pin area (disappear after heat treatment) | Heat-treat to remove stress, repair mold, or reduce injection/holding pressure |
15.1.18 | Excessive directional shrinkage or uneven filler distribution | Increase mold/material temperature, reduce injection speed, improve filler distribution |
15.1.19 | Warpage, poor weld lines | Adjust process parameters, mold temperature to reduce warpage and weld line defects |
15.1.20 | Improper storage or contact with solvents | Use proper packaging to avoid solvent contact |
15.1.21 | Hot runner temperature too high or too low | Adjust hot runner temperature |